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品牌:NXP USA Inc. 封装/外壳:模具 库存:8196pcs
品牌:NXP USA Inc. 封装/外壳:模具 库存:8485pcs
品牌:Analog Devices Inc./Maxim Integrated 封装/外壳:34-PowerCap™ 模块 库存:2215pcs
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品牌:Analog Devices Inc./Maxim Integrated 封装/外壳:28-DIP 模块(0.600",15.24mm) 库存:3336pcs
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品牌:Analog Devices Inc./Maxim Integrated 封装/外壳:24-DIP 模块(0.600",15.24mm) 库存:1876pcs
品牌:Analog Devices Inc./Maxim Integrated 封装/外壳:24-SOIC(0.295",7.50mm 宽) 库存:4161pcs
品牌:Analog Devices Inc./Maxim Integrated 封装/外壳:24-DIP 模块(0.600",15.24mm) 库存:9363pcs
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品牌:EPSON 封装/外壳:12-TFSOJ(0.094",2.40mm 宽) 库存:8866pcs
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Renesas Electronics America Inc 14-TSSOP(0.173",4.40mm 宽) 5218pcs
Renesas Electronics America Inc 8-SOIC(0.154",3.90mm 宽) 4459pcs
Renesas Electronics America Inc 8-SOIC(0.154",3.90mm 宽) 9856pcs
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