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品牌:Microchip Technology 封装/外壳:8-SOIC(0.154",3.90mm 宽) 库存:7969pcs
品牌:Microchip Technology 封装/外壳:8-SOIC(0.154",3.90mm 宽) 库存:7250pcs
品牌:Microchip Technology 封装/外壳:8-SOIC(0.154",3.90mm 宽) 库存:4877pcs
品牌:Microchip Technology 封装/外壳:8-SOIC(0.154",3.90mm 宽) 库存:8101pcs
品牌:Microchip Technology 封装/外壳:8-SOIC(0.154",3.90mm 宽) 库存:8028pcs
品牌:Microchip Technology 封装/外壳:14-SOIC(0.154",3.90mm 宽) 库存:6781pcs
品牌:Microchip Technology 封装/外壳:20-SSOP(0.209",5.30mm 宽) 库存:1932pcs
品牌:Microchip Technology 封装/外壳:16-VQFN 裸露焊盘 库存:4866pcs
品牌:Microchip Technology 封装/外壳:18-SOIC(0.295",7.50mm 宽) 库存:8262pcs
品牌:Cypress Semiconductor Corp 封装/外壳:24-UFQFN 裸露焊盘 库存:9735pcs
品牌:Cypress Semiconductor Corp 封装/外壳:32-VFQFN 裸露焊盘 库存:8688pcs
品牌:Cypress Semiconductor Corp 封装/外壳:16-SOIC(0.154",3.90mm 宽) 库存:4784pcs
品牌:Cypress Semiconductor Corp 封装/外壳:28-SSOP(0.209",5.30mm 宽) 库存:4315pcs
品牌:Microchip Technology 封装/外壳:20-SOIC(0.295",7.50mm 宽) 库存:9125pcs
品牌:Cypress Semiconductor Corp 封装/外壳:24-UFQFN 裸露焊盘 库存:3283pcs
品牌:Cypress Semiconductor Corp 封装/外壳:24-UFQFN 裸露焊盘 库存:8206pcs
品牌:Cypress Semiconductor Corp 封装/外壳:16-SOIC(0.154",3.90mm 宽) 库存:9386pcs
品牌:Cypress Semiconductor Corp 封装/外壳:16-SOIC(0.154",3.90mm 宽) 库存:7114pcs
品牌:Cypress Semiconductor Corp 封装/外壳:24-UFQFN 裸露焊盘 库存:5810pcs
品牌:Cypress Semiconductor Corp 封装/外壳:24-UFQFN 裸露焊盘 库存:1494pcs
品牌:Diodes Incorporated 封装/外壳:16-TSSOP(0.173",4.40mm 宽) 库存:2328pcs
品牌:Zilog 封装/外壳:28-TSSOP(0.173",4.40mm 宽) 库存:5314pcs
品牌:Analog Devices Inc./Maxim Integrated 封装/外壳:6-SMD,J 引线 库存:9544pcs
品牌:Cypress Semiconductor Corp 封装/外壳:24-UFQFN 裸露焊盘 库存:6955pcs
品牌:Cypress Semiconductor Corp 封装/外壳:24-UFQFN 裸露焊盘 库存:4023pcs
品牌:Cypress Semiconductor Corp 封装/外壳:24-UFQFN 裸露焊盘 库存:6328pcs
品牌:Cypress Semiconductor Corp 封装/外壳:24-UFQFN 裸露焊盘 库存:4430pcs
品牌:Cypress Semiconductor Corp 封装/外壳:24-UFQFN 裸露焊盘 库存:9002pcs
品牌:FTDI, Future Technology Devices International Ltd 封装/外壳:28-TSSOP(0.173",4.40mm 宽) 库存:2977pcs
品牌:Cypress Semiconductor Corp 封装/外壳:32-VFQFN 裸露焊盘 库存:8548pcs
品牌:FTDI, Future Technology Devices International Ltd 封装/外壳:20-SSOP(0.154",3.90mm 宽) 库存:2816pcs
品牌:FTDI, Future Technology Devices International Ltd 封装/外壳:20-SSOP(0.154",3.90mm 宽) 库存:8581pcs
Broadcom Limited - 6815pcs
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Broadcom Limited 400-BGA 5470pcs
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