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品牌:Nisshinbo Micro Devices Inc. 封装/外壳:18-LFSOP(0.173",4.40mm 宽)裸露焊盘 库存:4235pcs
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品牌:Nisshinbo Micro Devices Inc. 封装/外壳:18-LFSOP(0.173",4.40mm 宽)裸露焊盘 库存:3153pcs
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品牌:Nisshinbo Micro Devices Inc. 封装/外壳:8-SOIC(0.173",4.40mm 宽)裸露焊盘 库存:1303pcs
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品牌:Nisshinbo Micro Devices Inc. 封装/外壳:28-VQFN 裸露焊盘 库存:1181pcs
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