MB85RS4MLYPN-G-AWERE1
制造商:Kaga FEI America, Inc.
封装外壳:8-VDFN 裸露焊盘
描述:IC FRAM 4MBIT SPI 50MHZ 8DFN
斯普仑电子元件现货为您提供Kaga FEI America, Inc.设计生产的MB85RS4MLYPN-G-AWERE1,现有足量库存。MB85RS4MLYPN-G-AWERE1的封装/规格参数为:8-VDFN 裸露焊盘;同时斯普仑现货为您提供MB85RS4MLYPN-G-AWERE1数据手册/使用说明书等中文资料,资料中有MB85RS4MLYPN-G-AWERE1的详细使用方法及教程。
